Arm has joined the Open Compute Project (OCP) to tackle the increasing energy demands faced by AI-centric data centers. Their focus will be on supporting the integrated infrastructure with next-generation customized silicon and packaging technologies. This shift involves transitioning from traditional CPU, GPU, and memory systems to an integrated structure utilizing multiple chiplets in a single package using 2.5D and 3D technologies.
The Foundation Chiplet System Architecture (FCSA) proposed by Arm aims to provide a neutral standard framework that meets industry demands without being vendor or architecture-dependent. This architecture is expected to enhance power-performance optimization in future integrated data centers while expanding Arm’s ecosystem. Mohamed Awad, a senior vice president at Arm, emphasized the significance of power efficiency and customized processor design, stating the main challenge for data center builders is keeping up with surging energy needs.
In addition to OCP participation, Arm shares its vision for open collaboration and knowledge sharing among corporate partners and users. Their module-based design philosophy allows for tailored solutions without redesigning common system components, making it easier to innovate and adapt to the unique requirements of modern data centers.
👉 Pročitaj original: CIO Magazine
